| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| KH25L6433FM21-08G | NA |
SOP8 |
19+ |
52000 |
||||
| STi7197-BNUD | 一级 |
FPBGA700 |
12+ |
406 |
||||
| XC2S100E | 一级 |
TQ144 |
12+ |
374 |
||||
| DTQS24CPP045C,DVB-C | 12+ |
6390 |
||||||
| TDMB-Z052F | 一级 |
12+ |
1303 |
|||||
| AZ431AZ-A/TR-E1 | DIODES/美台 |
TO-92 |
20+ |
212 |
||||
| Hi3716MRBCV431ID002S | HISILICON/海思 |
TFBGA248 |
19+ |
1190 |
||||
| BM809A | 一级 |
SOT-23 |
12+ |
3144 |
||||
| EP2C35F672C8N | 一级 |
FBGA672 |
12+ |
74 |
||||
| AS9H1-CL66-2C1-1-A6 | NA |
NA |
20191209 |
200 |
||||
| W972GG6JB | DDRII |
WBGA84 |
15+ |
331 |
||||
| SN74AVC1T45DRLR | 一级 |
SOT-553 |
12+ |
9948 |
||||
| SC2005 | PBGA |
13+ |
228 |
|||||
| IPD06N03L | 一级 |
TO252 |
12+ |
5307 |
||||
| Hi3798MRBCV31100000 | HISILICON/海思 |
BGA |
20+ |
5300 |
||||
| MIC29302BU | TO-263-5 |
12+ |
800 |
|||||
| VH2G3ED7050 | 一级 |
11+ |
450 |
|||||
| BCM7468ZKFEB03G | 一级 |
BGA332 |
12+ |
370 |
||||
| W25Q64FVSSIG | NA |
SO8 |
20+ |
872 |
||||
| FP6137F | NA |
SOP8 |
20+ |
2865 |
||||
| MPQ8616GL | NA |
QFN3x4 |
20+ |
942 |
||||
| ADL5501AKSZ,6-Lead SC-70,RF IC | 12+ |
4472 |
||||||
| RTC6609 | NA |
TSON-6L |
20+ |
805 |
||||
| 74AHCT573D | NA |
SO20 |
20+ |
1110 |
||||
| JH601A-TC | NA |
BGA225 |
20+ |
584 |
||||
| CPLD,XC95216 | 一级 |
12+ |
21 |
|||||
| SP3232EEN | NA |
nSOIC16 |
20+ |
723 |
||||
| CXD3142R | LQFP80 |
12+ |
147 |
|||||
| MP2136EG-LF-Z | NA |
20+ |
1009 |
|||||
| Hi3716MRBCV431I0002S | NA |
TFBGA248 |
20+ |
580 |